封装市场

Challenges and Opportunities in the OSAT Market (August 15, 2017)
SEMI and TechSearch International Introduce Worldwide OSAT Manufacturing Sites Database (July 11, 2017)
Fan-Out Wafer Level Packaging Takes Off (November 1, 2016)
Packaging Materials Market Trends, Issues and Opportunities Part 3: Packaging Materials: Strong Growth Rates for Small Form Fact
Status of the Advanced Packaging Industry 2015 (March 29, 2016)
 
 
 
   
Semiconductor Packaging Materials Market Research
 
Summary

The electronics market sector is increasingly driven by consumer spending, where electronic products require more than performance and speed. Product look and feel, functionality, time to market, and cost are becoming critical factors, and packaging plays major role in delivering solutions to meet these needs.

Consumer electronics are changing how semiconductor devices are thinned, die attached, bonding wire and encapsulated, with materials playing a major role enabling the development of newer packaging technologies.

Typical Semiconductor Packaging Materials

  • Organics substrates
  • Leadframes
  • Mold Compounds
  • Underfill materials
  • Bonding wire
  • Liquid encapsulants
  • Solder balls
  • Wafer level package dielectrics
  • Thermal interface materials
  • Die attach materials

A key business issue with a consumer electronics driven market is that semiconductor manufacturers and packaging subcontractors are experiencing severe pricing pressure from their customers. Thus, manufacturers are pushing cost reduction at a faster pace to offset erosion in semiconductor average selling prices (ASP).

For the latest info, please view the info on this page as well as some of our products we have available for this market segment.

产品

Worldwide OSAT Manufacturing Sites Database
This brand new database offers access and insights into global OSAT facilities in China, Taiwan, Korea, Japan, Southeast Asia, Europe, and the Americas. The report also highlights new and emerging package offerings by manufacturing location. Specific details tracked include plant site technology capability such as Tape and Reel, Test, and packaging assembly service offered: BGA, specific leadframe type such as QFP, QFN, SO, flip chip bumping, WLP, Modules/SIP, etc,
Member $3,500 / Non-member $4,500
Multi-user licenses are available

 

 

Global Semiconductor Packaging Materials Outlook to 2021, coming soon!
This report is a comprehensive market research study that examines semiconductor packaging technology trends. Packaging materials markets are quantified, new opportunities are highlighted, and forecasts through 2019 are presented.
Member $5,000 / Non-member $6,000
Multi-user licenses are available

 

 

China Semiconductor Packaging Market Outlook
This newly released study covers China industry environment on its packaging market and government’s policy on the industry.  There are over 145 plants listed with recent activities including latest advanced packaging development, packaging equipment suppliers, material suppliers and material market in China.
Member $1,500 / Non-member $2,300
Multi-user licenses are available

 

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