SEMI标准计划聚集了专家，以交流思想并致力于制定全球公认的技术标准。

从SECS（SEMI设备通信标准）和GEM（制造设备的通信和控制通用模型）标准开始，最近又有了设备数据采集标准，SEMI标准计划已成为开发高级自动化标准的平台，从而使微电子行业的智能制造。

今天，信息与控制和自动化技术全球技术委员会继续制定新标准，审查诸如节能，可追溯性，后端处理自动化以及用于印刷电路板及相关行业的制造设备通信接口等主题。

通讯协议

• SEMI E4-0418 — SEMI设备通信标准1消息传输（SECS-I）的规范
• SEMI E5-1217 — SEMI设备通信标准2消息内容（SECS-II）的规范
• SEMI E37-0413 —高速SECS消息服务（HSMS）通用服务
• SEMI E39-0703 —对象服务标准：概念，行为和服务

设备控制

• SEMI E30-0418 — Specification for the Generic Model for Communications & Control of Manufacturing Equipment (GEM)
• SEMI E40-0813 — Standard for Processing Management
• SEMI E84-1109 — Specification for Enhanced Carrier Handoff Parallel I/O Interface
• SEMI E87-1017 — Specification for Carrier Management (CMS)
• SEMI E90-0312 — Specification for Substrate Tracking
• SEMI E94-0314 — Specification for Control Job Management

EQUIPMENT DATA ACQUISITION & PROCESS DIAGNOSTICS

• SEMI E120-0414 — Specification for the Common Equipment Model (CEM)
• SEMI E125-0414 — Specification for Equipment Self Description (EqSD)
• SEMI E128-0414 — Specification for XML Message Structures
• SEMI E132-1015 — Specification for Equipment Client Authentication and Authorization
• SEMI E134-0414 — Specification for Data Collection Management
• SEMI E138-0217 — Specification for XML Semiconductor Common Components
• SEMI E164-0414 — Specification for EDA Common Metadata
• SEMI E179-0320 — Specification for Protocol Buffers Common Components

ADVANCED ANALYTICS AND PROCESS CONTROL

• SEMI E116-0518 — Specification for Equipment Performance Tracking
• SEMI E126-0708 — Specification for Equipment Quality Information Parameters (EQIP)
• SEMI E133-0318 — Specification for Automated Process Control Systems Interface
• SEMI E157-0611 — Specification for Module Process Tracking

DATA MANAGEMENT

• SEMI E151-1211 — Guide for Understanding Data Quality
• SEMI E160-1211 — Specification for Communication of Data Quality
• SEMI E172-0118 — Specification for SECS Equipment Data Dictionary (SEDD)
• SEMI E173-0415 — Specification for XML SECS-II Message Notation (SMN)

SURFACE-MOUNT TECHNOLOGY ASSEMBLY LINES AUTOMATION [SMT-ELS]

• SEMI A1 — Specification for Horizontal Communication (HC) Between Equipment for Factory Automation System                  
• SEMI A1.1 — Specification for Media Interface for A Horizontal Communication (HC) Between Equipment
• SEMI A2 — Specification for Surface Mount Assembler Smart Hookup (SMASH) 

AUTOMATION FOR ADJACENT INDUSTRIES

• SEMI A3 - Specification for Printed Circuit Board Equipment Communication Interfaces (PCBECI)
• SEMI HB4 - Specification of Communication Interfaces for High Brightness LED Manufacturing Equipment (HB-LED ECI)
• SEMI PV2 - Guide for PV Equipment Communication Interfaces (PVECI)

Future Topics to Support Smart Manufacturing

• Data security
• Big data integration
• Virtual Metrology
• Predictive Analytics
• Digital Twin
• Supply chain integration
• Data and IP partitioning