| 4/26-4/27 SEMI 化合物半导体活动安排 | |
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4月26日 08:30-15:30 Apr. 26th 08:30-15:30 |
SEMI 化合物半导体标准技术委员会2023年度春季会议 SEMI Standards Compound Semiconductor Materials China TC Chapter Spring Meeting 2023 |
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4月27日 08:30-17:00 Apr. 27th 08:30-17:00 |
SEMI 化合物半导体材料技术论坛 SEMI Compound Semiconductor Materials Technology Forum |
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地点：光大We谷A2栋2楼国际厅（广东省东莞市松山湖总部二路） Venue: 2F International Conference Room, A2 Building of Guangda We Valley (Headquarters 2nd Road, Songshanlake, Dongguan, Guangdong) |
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（←移动端在线登记二维码/QR code for Online Registration） | 08:30-09:00 | 签到 / Registration | |
09:00-09:15
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欢迎致辞 / Welcome Remark 居龙，SEMI全球副总裁、中国区总裁 Lung Chu, President, SEMI China; Vice President, SEMI |
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康凯，广东中图半导体科技股份有限公司，总经理 Kai Kang, GM of Sinopatt Technology Co.,Ltd. |
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09:15-09:45
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新一代显示用Mini/Micro LED芯片技术研究与展望 Technology Research And Prospect of Mini/Micro LED Chips for Next Generation Display Application 王江波，华灿光电股份有限公司，副总裁兼首席技术官 Jiangbo Wang, VP/CTO of HC SemiTek Corporation |
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09:45-10:15
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蓝宝石图形化产品应用及发展趋势 Application and Developing Trend for Patterned Sapphire Substrate 张能，广东中图半导体科技股份有限公司，产品总监 Neng Zhang, Product Director of Sinopatt Technology Co.,Ltd. |
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10:15-10:45
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3DIC技术在化合物半导体器件领域的应用与前景 Applications and Prospects of 3DIC Technology in Compound Semiconductor Devices 范谦，苏州汉骅半导体有限公司，副总裁 Qian Fan, VP of Suzhou HanHua Semiconductor Co.，Ltd |
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10:45-11:15
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大尺寸、高质量氮化铝单晶PVT生长最新进展及其挑战 Latest Progress and Challenges on High-quality and Large-size AlN Single Crystals Grown by the PVT Method 吴亮，奥趋光电技术（杭州）有限公司，CEO Jason Wu, CEO of Ultratrend Technologies Inc. |
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11:15-11:45 
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面向化合物半导体材料与器件的微纳加工平台 Micro&Nano Fabrication Platform of Compound Semiconductor Materials and Devices 汪洋，松山湖材料实验室，微加工与器件平台副主任，研究员级高工 Yang Wang, Professor, Vice Director of Micro-Nano Fabrication and Device Center, Songshan Lake Materials Laboratory |
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11:45-12:15 
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化合物半导体产业的智能制造探索 Exploration of Intelligent Manufacturing in Compound Semiconductor Industry 刘波，珂矽信息技术（上海）有限公司，执行副总 Clare Liu, Vice General Manager of Kxware Information Technology (Shanghai) Co., Ltd |
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| 12:15-13:30 | 休息 / Break | |
13:30-14:00 
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大尺寸化合物半导体的加工与应用展望 Processing and Application Prospectives of Large-Scale Compound Semiconductors 周铁军，广东先导微电子科技有限公司，总经理 Terry Zhou, GM of Vital Micro-Electronics Technology Co., Ltd |
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14:00-14:30
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超宽禁带半导体材料氧化镓及其器件产业化分析 Industrialization Analysis of Ultra-wide Bandgap Semiconductor Material Gallium Oxide and Its Devices 陈政委，北京铭镓半导体有限公司，总经理 Zhengwei Chen, GM of Beijing Ming Gallium Semiconductor Co., Ltd. |
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14:30-15:00
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4英寸氮化镓自支撑晶圆的HVPE生长技术 HVPE Growth of 4 Inch GaN Freestanding Wafer 刘德昂，镓特半导体科技（上海）有限公司，科学家 De'ang Liu, Scientist of ETARESEARCH |
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15:00-15:30
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SiC单晶生长技术浅析及应用展望 Analysis of SiC Single Crystal Growth Technology and Application Prospect of SiC Materials 马康夫，山西烁科晶体有限公司，总经理助理/高级工程师 Kangfu Ma, GMA of Shanxi Shuoke Crystal Co.,Ltd. |
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15:30-16:00
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SiC衬底切磨抛工艺最新进展与发展趋势 Recent Progress and Development Trend of SiC Substrate Polishing Technology 陈斌，深圳中机新材料有限公司，创始人/董事长 Bin Chen, Board Chair of OFC MicroMaterial (Shenzhen) Co., Ltd. |
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16:00-16:30
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晶圆级和热沉级金刚石产业化的最新进展 The Latest Progress in The Industrialization of Diamond Wafer and Diamond Heat Sink 张星，化合积电（厦门）半导体科技有限公司，CEO Xing Zhang, CEO of Compound Semiconductor (Xiamen) Technology Co., Ltd. |
（←移动端在线登记二维码/QR code for Online Registration） 
| 李晓倩 / Cassie Li | 吴迪 / Ein Wu | ||
| Tel: 021.6027.7645 | Tel: 021.6027.8509 | ||
| Email: [email protected] | Email: [email protected] |
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