11/17-11/18 SEMI 化合物半导体活动安排
时间/Time 活动名称/Event
11月17日 12:30-17:00
Nov. 17th 12:30-17:00
SEMI 化合物半导体标准技术委员会2022年度秋季会议
SEMI Standards Compound Semiconductor China TC Chapter Fall Meeting 2022
11月18日 08:30-17:00
Nov. 18th 08:30-17:00
SEMI 化合物半导体材料技术研讨会
SEMI Compound Semiconductor Materials Technology Seminar
地点:光大We谷A2栋2楼国际厅(广东省东莞市松山湖总部二路)
Venue: 2F International Conference Room, A2 Building of Guangda We Valley (Headquarters 2nd Road, Songshanlake, Dongguan, Guangdong)

主办/Organizer:        
           
承办及赞助
Co-organizer & Sponsor:
     
           
赞助/Sponsor:  

报名方式:请于2022/11/14 17:00前通过在线登记或填写《参会回执》发送至SEMI中国办事处Ein Wu [email protected] (TEL: 021.6027.8509) 完成会议登记。
Please register via Online Registration or reply RSVP to SEMI China Ein Wu ([email protected]) before 2022/11/14 17:00.
(←移动端在线登记二维码/QR code for Online Registration)

一、会议时间 Meeting Time:
11月18日 SEMI 化合物半导体材料技术研讨会
Nov.18th SEMI Compound Semiconductor Materials Technology Seminar

地点:光大We谷A2栋2楼国际厅(广东省东莞市松山湖总部二路)
Venue: 2F International Conference Room, A2 Building of Guangda We Valley (Headquarters 2nd Road, Songshanlake, Dongguan, Guangdong)

Note: Forum language is mandarin, no simultaneous Interpretation provided

   
08:30-09:00   签到 / Registration
     
09:00-09:15
  欢迎致辞 / Welcome Remark
居龙,SEMI全球副总裁、中国区总裁
Lung Chu, President, SEMI China; Vice President, SEMI
   
  康凯,广东中图半导体科技股份有限公司,总经理
Kai Kang, GM of Sinopatt Technology Co.,Ltd.
   
09:15-09:45
  MicroLED大规模制造关键技术
Key Technologies for Mass Manufacturing of MicroLEDs

王江波,华灿光电(浙江)有限公司,副总裁
Jiangbo Wang, VP of HC SemiTek Corporation
   
09:45-10:15
  蓝宝石图形化产品应用及发展趋势
Application and Developing Trend for Patterned Sapphire Substrate

张能,广东中图半导体科技股份有限公司,产品总监
Neng Zhang, Product Director of Sinopatt Technology Co.,Ltd.
   
10:15-10:45
  3DIC技术在化合物半导体器件领域的应用与前景
Applications and Prospects of 3DIC Technology in Compound Semiconductor Devices

范谦,苏州汉骅半导体有限公司,副总裁
Qian Fan, VP of Suzhou HanHua Semiconductor Co.,Ltd
     
10:45-11:15
  大尺寸、高质量氮化铝单晶PVT生长最新进展及其挑战
Latest Progress and Challenges on High-quality and Large-size AlN Single Crystals Grown by the PVT Method

吴亮,奥趋光电技术(杭州)有限公司,CEO
Jason Wu, CEO of Ultratrend Technologies Inc.
   
11:15-11:45
  面向化合物半导体材料与器件的微纳加工平台
Micro&Nano Fabrication Platform of Compound Semiconductor Materials and Devices

汪洋,松山湖材料实验室,微加工与器件平台副主任,研究员级高工
Yang Wang, Professor, Vice Director of Micro-Nano Fabrication and Device Center, Songshan Lake Materials Laboratory
   
11:45-13:30   休息 / Break
   
13:30-14:00
  大尺寸化合物半导体的加工与应用展望
Processing and Application Prospectives of Large-Scale Compound Semiconductors

周铁军,广东先导微电子有限公司,总经理
Terry Zhou, GM of Vital Micro-Electronics Technology Co., Ltd
   
14:00-14:30
  超宽禁带半导体材料氧化镓及其器件产业化分析
Industrialization Analysis of Ultra-wide Bandgap Semiconductor Material Gallium Oxide and Its Devices

陈政委,北京铭镓半导体有限公司,总经理
Zhengwei Chen, GM of Beijing Ming Gallium Semiconductor Co., Ltd.
   
14:30-15:00
  4英寸氮化镓自支撑晶圆的HVPE生长技术
HVPE Growth of 4 Inch GaN Freestanding Wafer

刘德昂,镓特半导体科技(上海)有限公司,科学家
De'ang Liu, Scientist of ETARESEARCH
   
15:00-15:30
  SiC单晶生长技术浅析及应用展望
Analysis of SiC Single Crystal Growth Technology and Application Prospect of SiC Materials

马康夫,山西烁科晶体有限公司,总经理助理/高级工程师
Kangfu Ma, GMA of Shanxi Shuoke Crystal Co.,Ltd.
   
15:30-16:00
  大规模AlN和AlScN沉积技术及SMR体声波滤波器
Large Scale Deposition Technology of AlN and AlScN for SMR BAW

季泳,贵州皓天光电科技有限公司,CEO
Yong Ji, CEO of Guizhou Haotian Optoelectronics Technology Co.,Ltd.
   
16:00-16:30
  晶圆级和热沉级金刚石产业化的最新进展
The Latest Progress in The Industrialization of Diamond Wafer and Diamond Heat Sink

张星,化合积电(厦门)半导体科技有限公司,CEO
Xing Zhang, CEO of Compound Semiconductor (Xiamen) Technology Co., Ltd.

二、同期会议 Concurrent Meeting:
11月17日 SEMI 化合物半导体标准技术委员会2022年度秋季会议
Nov.17th SEMI Standards Compound Semiconductor China TC Chapter Fall Meeting 2022
地点:光大We谷A2栋2楼国际厅(广东省东莞市松山湖总部二路)
Venue: 2F International Conference Room, A2 Building of Guangda We Valley (Headquarters 2nd Road, Songshanlake, Dongguan, Guangdong)

12:30 – 13:00 签到入场 / Registration
13:00 – 13:25 会议开幕 / Welcome & Call to Order
13:25 – 13:30 审阅前次会议纪要 / Review and Approval of Previous Meeting Minutes
13:30 – 13:35 SEMI标准工作进展汇报 / SEMI Staff Report
13:35 – 13:50 SEMI各地区联合汇报(北美、欧洲、日本) / Liaison Reports
13:50 – 13:55 SEMI中国区化合物半导体标准技术委员会2022年第二季度发布标准 / SEMI China CS TC Published Standards in 2022 Announcement
13:55 – 14:15 工作组汇报 / Task Forces Reports
14:15 – 14:55 新工作组申请 / New TFOF Application
14:55 – 16:15 全球投票申请 / Documents Request for Ballots
16:15 – 16:20 建设性意见讨论 / New Action Items & Update
16:20 – 16:25 下次会议时间和地点 / Next Meeting Date & Locale

会议讨论如下标准项目:


三、会议地点 Meeting Location:
地点:光大We谷A2栋2楼国际厅(广东省东莞市松山湖总部二路)
Venue: 2F International Conference Room, A2 Building of Guangda We Valley (Headquarters 2nd Road, Songshanlake, Dongguan, Guangdong)

四、报名方式 Registration:
报名方式:请于2022/11/14 17:00前通过在线登记或填写《参会回执》发送至SEMI中国办事处Ein Wu [email protected] (TEL: 021.6027.8509) 完成会议登记。
Please register via Online Registration or reply RSVP to SEMI China Ein Wu ([email protected]) before 2022/11/14 17:00.
(←移动端在线登记二维码/QR code for Online Registration)

五、市场推广机会 Marketing Promotion Opportunity:
抓住市场推广良机,SEMI中国化合物半导体活动赞助细节如下:
SEMI 有效企业会员优惠赞助价格请咨询Ein吴: [email protected],021-60278509


六、交通提示 Traffic Reminder:
会议地点:光大We谷A2栋2楼国际厅(广东省东莞市松山湖总部二路)
Venue: 2F International Conference Room, A2 Building of Guangda We Valley (Headquarters 2nd Road, Songshanlake, Dongguan, Guangdong)
»  距离东莞松湖湾华美达广场酒店约700米,车程约3分钟;
»  距离虎门高铁站约22公里,车程约45分钟;
»  距离深圳宝安国际机场约55公里,车程约65分钟;
»  Venue to Ramada Plaza By Wyndham Dongguan Songshan Lake 700 meters, 3 minutes'drive.
»  Venue to Humen Railway Station 22 miles, 45 minutes'drives.
»  Venue to Shenzhen Bao'an International Airport 55 miles, 65 minutes'drive.

七、联系方式:
戚发鑫 / Daniel Qi 李晓倩 / Cassie Li (标委会联系人) 吴迪 / Ein Wu  
Tel: 021.6027.8576 Tel: 021.6027.7654 Tel: 021.6027.8509  
Email: [email protected] Email: [email protected] Email: [email protected]  

主办/Organizer:        
           
承办及赞助
Co-organizer & Sponsor:
     
           
赞助/Sponsor: